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September 2019
Signing Ceremony for the Hefei Changxin Integrated Circuit Manufacturing Base

On September 21, the documents creating the Hefei Changxin Integrated Circuit Manufacturing Base project were signed, with the project receiving a total investment of over 220 billion RMB. The project will develop upstream and downstream industrial chains and provide lifestyle service facilities centered on CXMT. It is committed to building a national memory industry base and world-class memory industry cluster.

September 2019
CXMT announces production of its first 8Gb DDR4 product

On September 20, CXMT’s international mainstream 10G1 8Gb DDR4 was put into production, with a designed wafer production capacity of 120K/month in Phase I. This event marked a breakthrough in memory chip mass production in China, demonstrating the country has achieved independent production capacity of this key strategic components.

September 2019
International Recognition

On September 17, Global Semiconductor Alliance announced the appointment of Mr. Yiming Zhu, Chairman and CEO of CXMT, to its Board of Directors, reflecting the industry’s recognition of CXMT.

May 2019
Global Semiconductor Alliance Memory+ Summit

On May 15, CXMT made its first appearance at this international forum. There, Mr. Yiming Zhu, Chairman and CEO of CXMT, delivered the keynote speech Development of Memory Technologies and Solutions in China of the GSA Summit, discussing the great demand and opportunities the new era has brought to China’s memory market.